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The Intel Data Center GPU Max Series is designed to take on the most challenging high-performance computing (HPC) and AI workloads. The Intel Xe Link high-speed, coherent, unified fabric offers flexibility to run any form factor to enable scale up and scale out.
Intel Data Center GPU Max Series is designed for breakthrough performance in data intensive computing models used in AI and HPC. Based on the X HPC architecture that uses both EMIB 2.5D and Foveros packaging technologies to combine 47 active tiles onto a single GPU, fabricated on five different process nodes, Intel Max Series GPUs enable greater flexibility and modularity in the construction of the SOC.
Intel’s foundational GPU compute building block features:
• Up to 408 MB of L2 cache based on discrete SRAM technology, 64 MB of L1 cache and up to 128 GB of high-bandwidth memory.
• Up to 128 ray tracing units built into each Max Series GPU for accelerating scientific visualization and animation.
• AI-boosting Intel® X Matrix Extensions (XMX) with deep systolic arrays enabling vector and matrix capabilities in a single device.
• one API standards-based, multiarchitecture programming and tools, which boost performance and productivity and overcome proprietary programming model lock-in.
Accelerating HPC and AI Workloads Across Multiple Architectures
AI models continuously require larger data sets for more effective training. The faster you can process the data, the faster you can train and deploy the model. The GPU accelerates end-to end AI and data analytics pipelines with libraries optimized for Intel architectures and configurations tuned for HPC and AI workloads, high-capacity storage and high-bandwidth memory.
• Built-in Ray Tracing Acceleration
Accelerate scientific visualization and animation with up to 128 ray tracing units incorporated on each Intel® Max Series GPU.
• Intel® Xe Matrix Extensions (XMX)
Accelerate AI workloads and enable vector and matrix capabilities in a single device with Intel® Xe Matrix Extensions (XMX) built with deep systolic arrays.
• A 300-watt double-wide AIC card with 56 X cores and 48 GB of HBM2E memory. Multiple cards can be connected via Intel X Link bridges.
| Xe-cores |
128 |
| Ray Tracing Units | 128 |
| Intel® Xe Matrix Extensions (Intel® XMX) Engines | 1024 |
| Xe Vector Engines | 1024 |
| Graphics Max Dynamic Clock |
1600 MHz
|
| Graphics Base Clock |
900 MHz
|
| Intel® Xe Link Maximum Frequency |
53 Gbps
|
| TDP | 600W |
| PCI Express Configurations |
Gen 5 x16
|
|
Device ID
|
0x0BD5
|
|
Memory Size
|
128GB
|
|
Memory Type
|
HBM2e
|
|
Graphics Memory Interface
|
1024 bit
|
|
Graphics Memory Bandwidth
|
3276.8 GB/s
|
|
Ray Tracing
|
Yes
|
|
oneAPI Support
|
Yes
|
|
of Displays Supported
|
0
|
|
H.264 Hardware Encode/Decode
|
No
|
